LT3694/LT3694-1
26
36941fb
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE20 (CB) TSSOP REV I 0211
0.09 0.20
(.0035 .0079)
0? 8?/DIV>
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 0.75
(.020 .030)
4.30 4.50*
(.169 .177)
1 3 4 5 6 7 8 9 10
11
12
1413
6.40 6.60*
(.252 .260)
3.86
(.152)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 0.15
(.002 .006)
0.65
(.0256)
BSC
0.195 0.30
(.0077 .0118)
TYP
2
2.74
(.108)
0.45 ?.05
0.65 BSC
4.50 ?.10
6.60 ?.10
1.05 ?.10
3.86
(.152)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev I)
Exposed Pad Variation CB